Spartan-7 Product Advantage Value Features Programmable System Integration High pin-count to logic ratio for I/O connectivity MicroBlaze processor soft IP Integrated security and monitori

Virtex® UltraScale+™ devices provide the highest performance and integration capabilities in a 14nm/16nm FinFET node. Xilinx 3rd generation 3D ICs use stacked silicon interconnect (SSI) technology to break through the limitations of Moore’s law and deliver the highest signal processing and serial I/O bandwidth to satisfy the most demanding design requirements.

Kintex® UltraScale+™ devices provide the best price/performance/watt balance in a FinFET node, delivering a cost-effective solution for applications that require high-end capabilities including 33Gb/s transceivers and 100G connectivity cores.

Spartan-6 Product Advantage Value Features Programmable System Integration High pin-count to logic ratio for I/O connectivity Over 40 I/O standards for simplified system design PCI Expres...

Kintex®-7 FPGAs provide your designs with the best price/performance/watt at 28nm while giving you high DSP ratios, cost-effective packaging, and support for mainstream standards like PCIe® Gen3 and 10 Gigabit Ethernet. The Kintex-7 family is ideal for applications including 3G and 4G wireless, flat panel displays, and video over IP solutions.

Virtex®-7 FPGAs are optimized for system performance and integration at 28nm and bring best-in-class performance/watt fabric, DSP performance, and I/O bandwidth to your designs. The family is used in an array of applications such as 10G to 100G networking, portable radar, and ASIC Prototyping.